Hill Engineering Blog

SEM Annual Conference and Exposition on Experimental and Applied Mechanics

Hill Engineering will be presenting at the upcoming Annual 2017 Conference and Exposition on Experimental and Applied Mechanics, which is organized by the Society of Experimental Mechanics (SEM). The conference will run from June 12, 2017 through June 15, 2017 and will be located in Indianapolis, IN. We invite you to come see us while we share some recent work about residual stress measurement repeatability using the contour method. The abstract text is presented below.

This presentation examines precision of the contour method using five residual stress measurement repeatability studies. The test specimens evaluated include: an aluminum T-section, a stainless steel plate with a dissimilar metal slot-filled weld, a stainless steel forging, a titanium plate with an electron beam slot-filled weld, and a nickel disk forging.

These specimens were selected to encompass a range of typical materials and residual stress distributions. Each repeatability study included contour method measurements on 5 to 10 similar specimens. Following completion of the residual stress measurements an analysis was performed to determine the repeatability standard deviation of each population. In general, the results of the various contour method residual stress measurement repeatability studies are similar.

The repeatability standard deviation for the contour method tends to be relatively small throughout the part interior and there are localized regions of higher repeatability along the part perimeter. The repeatability standard deviations over most of the cross-section range from 5 MPa, for the aluminum T-section, to 35 MPa, for the stainless steel forging. These results provide expected precision data for the contour method over a broad range of specimen geometries, materials, and stress profiles.

If you are planning to attend the conference please stop by to discuss Hill Engineering’s capabilities in residual stress measurement. Please contact us for more information.