Ryan Tucci, Author at Hill Engineering

Overcoming Challenges in Residual Stress Measurements on Small Test Specimens Using the Slitting Method

by Ryan Tucci

When it comes to measuring residual stress in small test specimens, precision is paramount. The slitting method is well suited to this application due to the high accuracy of wire EDM machining. However, this method is not without its challenges, especially when applied to very small test specimens, such as the 0.022-inch diameter wire we recently measured.

Deep-Hole Drilling on a bent-beam specimen

by Ryan Tucci

In 2019 Hill Engineering licensed VEQTER Ltd.’s world-leading Deep-Hole Drilling (DHD) technology. Under this agreement, Hill Engineering is delivering state-of-the-art DHD measurements within the North and South American Continents. Results from a recent DHD measurement on a bent-beam specimen are shared in this blog post.

Hill Engineering acquires new 3D scanner

by Ryan Tucci

At Hill engineering we are always looking out for new technologies to improve our laboratory capability. As a part of this ongoing mission, we recently acquired a Nikon ModelMaker H120 3D scanner to incorporate in our lab. Continue reading Hill Engineering acquires new 3D scanner