2024 SEM Annual Conference and Exposition on Experimental and Applied Mechanics

Hill Engineering will be presenting at the 2024 SEM Annual Conference and Exposition on Experimental and Applied Mechanics in Vancouver, WA, from June 3rd through June 6th. We invite you to come see us!

This conference focuses on all areas of research and applications pertaining to experimental mechanics and has evolved to encompass the latest technologies supporting optical methods; additive & advanced manufacturing; dynamic behavior of materials; biological systems; micro-and nano mechanics; fatigue and fracture; composite and multifunctional materials; residual stress; inverse problem methodologies; thermomechanics; and time dependent materials. Hill Engineering’s presentation will include a summary of recent work related to residual stress measurement using the hole drilling method. The abstract text is presented below.

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On the Road with the Residual Stress Field Team

In the ever-evolving landscape of materials science and engineering, on-site solutions are an important component of residual stress testing. That’s why we at Hill Engineering have a dedicated residual stress field team, capable of traveling directly to customers’ locations in order to deliver the same precision and data quality of our in-house residual stress measurements.

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Hill Engineering Joins CMTC’s Made in California Program: A New Chapter in Manufacturing Excellence

In an exciting development for both the aerospace industry and the state of California, Hill Engineering has officially been welcomed to the California Manufacturing Technology Consulting (CMTC) Made in California Program.

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AS7045 – Residual Stress Measurement and Classification, Metallic Structural Alloy Products and Finished Parts

A new Aerospace Standard, AS7045 – Residual Stress Measurement and Classification, Metallic Structural Alloy Products and Finished Parts, was recently published by SAE International. Hill Engineering was actively involved in the development of the standard along with many of our collaborators in the aerospace industry. AS7045 offers tremendous potential to revolutionize the management of residual stress during metallic material procurement.

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Overcoming Challenges in Residual Stress Measurements on Small Test Specimens Using the Slitting Method

When it comes to measuring residual stress in small test specimens, precision is paramount. The slitting method is well suited to this application due to the high accuracy of wire EDM machining. However, this method is not without its challenges, especially when applied to very small test specimens, such as the 0.022-inch diameter wire we recently measured.

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New publication: Effects of high‑energy laser peening followed by pre‑hot corrosion on stress relaxation, microhardness, and fatigue life and strength of single‑crystal nickel CMSX‑4® superalloy

Hill Engineering recently published new collaborative research in the International Journal of Advanced Manufacturing Technology titled Effects of high‑energy laser peening followed by pre‑hot corrosion on stress relaxation, microhardness, and fatigue life and strength of single‑crystal nickel CMSX‑4® superalloy and appears in International Journal of Advanced Manufacturing Technology. The abstract text is available here along with a link to the publication.

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Publication alert – Multiscale framework for prediction of residual stress in additively manufactured functionally graded material

Hill Engineering recently published new research with collaborators from around the world including South Korea, Australia, China, and the United Kingdom. The work is titled Multiscale framework for prediction of residual stress in additively manufactured functionally graded material. The abstract text is available here along with a link to the publication.

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Hill Engineering’s DART issued second US patent!

Hill Engineering has been recently issued its second US patent for the DART™ measurement system. This updated device offers improved residual stress measurements within small-diameter pipe applications, allowing for more accurate analysis in both in-laboratory and non-laboratory settings.

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